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Publication numberUSD589473 S1
Publication typeGrant
Application numberUS 29/293,537
Publication dateMar 31, 2009
Filing dateNov 30, 2007
Priority dateMay 30, 2007
Publication number29293537, 293537, US D589473 S1, US D589473S1, US-S1-D589473, USD589473 S1, USD589473S1
InventorsNaohide Takamoto, Sadahito Misumi, Takeshi Matsumura, Yasuhiro Amano
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Adhesive film material for use in manufacturing semiconductors
US D589473 S1
Abstract  available in
Images(10)
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Claims(1)
  1. The ornamental design for adhesive film material for use in manufacturing semiconductors, as shown and described.
Description

FIG. 1 is a perspective view of a first embodiment of the adhesive film material for use in manufacturing semiconductors showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a plan view thereof;

FIG. 4 is a right side view, the left side being a mirror image thereof;

FIG. 5 is an enlarged plan view of the design as identified by A and B in FIG. 2;

FIG. 6 is a sectional view taken along line 66 in FIG. 5;

FIG. 7 is a sectional view taken along line 77 in FIG. 5;

FIG. 8 is a perspective view of a second embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 9 is a front view thereof;

FIG. 10 is a plan view thereof;

FIG. 11 is a right side view, the left side being a mirror image thereof;

FIG. 12 is an enlarged plan view of the design as identified by A and B in FIG. 9;

FIG. 13 is a sectional view taken along line 1313 in FIG. 12;

FIG. 14 is a sectional view taken along line 1414 in FIG. 12;

FIG. 15 is a perspective view of a third embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 16 is a front view thereof;

FIG. 17 is a plan view thereof;

FIG. 18 is a right side view, the left side being a mirror image thereof;

FIG. 19 is an enlarged plan view of the design as identified by A and B in FIG. 16;

FIG. 20 is a sectional view taken along line 2020 in FIG. 19; and,

FIG. 21 is a sectional view taken along line 2121 in FIG. 19.

Classifications
U.S. ClassificationD13/182
Legal Events
DateCodeEventDescription
Sep 18, 2008ASAssignment
Owner name: WOLFSON MICROELECTRONICS PLC, UNITED KINGDOM
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LAMING, RICHARD IAN;BEGBIE, MARK;REEL/FRAME:021552/0573
Effective date: 20080821