Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD592030 S1
Publication typeGrant
Application numberUS 29/295,294
Publication dateMay 12, 2009
Filing dateSep 25, 2007
Priority dateOct 26, 2004
Also published asUSD559066, USD584591, USD592029, USD600989
Publication number29295294, 295294, US D592030 S1, US D592030S1, US-S1-D592030, USD592030 S1, USD592030S1
InventorsHiroyuki Tano, Hiroshi Shiho
Original AssigneeJsr Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad
US D592030 S1
Abstract  available in
Previous page
Next page
  1. The ornamental design for a polishing pad, as shown and described.

FIG. 1 is a top plan view of a polishing pad showing our new design;

FIG. 2 is a front elevational view thereof, the rear elevational view, left side and front side elevational views thereof being mirror images of the views shown;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a partially enlarged view of portion 44 in FIG. 1;

FIG. 5 is a partially enlarged sectional view taken substantially along line 55 in FIG. 4;

FIG. 6 is a partially enlarged sectional view taken substantially along line 66 in FIG. 4;

FIG. 7 is a partially enlarged drawing of portion 77 in FIG. 3;

FIG. 8 is a partially enlarged sectional view of portion 8 in FIG. 5; and,

FIG. 9 is a partially enlarged view of section 99 in FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9180570Mar 16, 2009Nov 10, 2015Nexplanar CorporationGrooved CMP pad
USD795666 *Jun 6, 2014Aug 29, 2017Diamond Tool Supply, Inc.Polishing pad
U.S. ClassificationD08/70