|Publication number||USD594424 S1|
|Application number||US 29/282,117|
|Publication date||Jun 16, 2009|
|Filing date||Jul 12, 2007|
|Priority date||Jul 12, 2007|
|Publication number||282117, 29282117, US D594424 S1, US D594424S1, US-S1-D594424, USD594424 S1, USD594424S1|
|Inventors||Cheng-Feng Lin, Tsang-Chou Lee|
|Original Assignee||Hiwin Mikrosystem Corp.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (1), Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
US D594424 S1
The ornamental design for a wafer carrier, as shown and described.
FIG. 1 is a perspective view of a wafer carrier showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view to that shown.
The broken line showing portion of the wafer carrier is for illustrative purposes only and forms no part of the claimed design.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|USD749531 *||Dec 2, 2014||Feb 16, 2016||Gudeng Precision Industrial Co., Ltd.||Diffusion assembly for front opening unified pod|