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Publication numberUSD594424 S1
Publication typeGrant
Application numberUS 29/282,117
Publication dateJun 16, 2009
Filing dateJul 12, 2007
Priority dateJul 12, 2007
Publication number282117, 29282117, US D594424 S1, US D594424S1, US-S1-D594424, USD594424 S1, USD594424S1
InventorsCheng-Feng Lin, Tsang-Chou Lee
Original AssigneeHiwin Mikrosystem Corp.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Wafer carrier
US D594424 S1
Abstract  available in
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  1. The ornamental design for a wafer carrier, as shown and described.

FIG. 1 is a perspective view of a wafer carrier showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view to that shown.

The broken line showing portion of the wafer carrier is for illustrative purposes only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD749531 *Dec 2, 2014Feb 16, 2016Gudeng Precision Industrial Co., Ltd.Diffusion assembly for front opening unified pod
U.S. ClassificationD13/182