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Publication numberUSD597498 S1
Publication typeGrant
Application numberUS 29/321,528
Publication dateAug 4, 2009
Filing dateJul 18, 2008
Priority dateJul 18, 2008
Publication number29321528, 321528, US D597498 S1, US D597498S1, US-S1-D597498, USD597498 S1, USD597498S1
InventorsDi-Qiong Zhao, Hong-Bo Deng, Ye Chen
Original AssigneeFoxconn Technology Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D597498 S1
Abstract  available in
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  1. The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7942194Aug 7, 2007May 17, 2011Fujikura Ltd.Heat sink
US20100051231 *Jun 11, 2009Mar 4, 2010Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation apparatus having a heat pipe inserted therein
US20100230074 *Jun 15, 2009Sep 16, 2010Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd.Heat dissipation apparatus
US20110079368 *Oct 6, 2009Apr 7, 2011Asia Vital Components Co., Ltd.Fixing mount and thermal module thereof
U.S. ClassificationD13/179