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Publication numberUSD599750 S1
Publication typeGrant
Application numberUS 29/325,554
Publication dateSep 8, 2009
Filing dateOct 2, 2008
Priority dateJun 20, 2008
Publication number29325554, 325554, US D599750 S1, US D599750S1, US-S1-D599750, USD599750 S1, USD599750S1
InventorsDae Hyun Kim, Hun Joo Hahm, Hyung Suk Kim, Dae Yeon Kim, Young Sam Park, Do Hun Kim, Seong Yeon Han
Original AssigneeSamsung Electro-Mechanics Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Case for light emitting diode
US D599750 S1
Abstract  available in
Images(3)
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Claims(1)
  1. We claim the ornamental design for a case for light-emitting diode, as shown and described.
Description

FIG. 1 is the perspective view of a case for light-emitting diode

FIG. 2 is the front view thereof

FIG. 3 is the rear view thereof

FIG. 4 is the left side view thereof

FIG. 5 is the right side view thereof

FIG. 6 is the top plan view thereof; and,

FIG. 7 is the bottom view thereof, wherein the broken lines showing portions of the LED are for illustrative purpose only and form no part of the claimed design.

The article is composed of synthetic resin and metal.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD667384 *Nov 17, 2011Sep 18, 2012Lextar Electronics Corp.Light emitting diode lead-frame
USD668233 *Oct 24, 2011Oct 2, 2012Silitek Electronic (Guangzhou) Co., Ltd.LED package
USD793001 *Jun 24, 2016Jul 25, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
USD793002 *Jun 24, 2016Jul 25, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
USD793618 *Jun 24, 2016Aug 1, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
USD795492 *Jun 24, 2016Aug 22, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
Classifications
U.S. ClassificationD13/180