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Publication numberUSD600220 S1
Publication typeGrant
Application numberUS 29/309,698
Publication dateSep 15, 2009
Filing dateSep 26, 2008
Priority dateMar 28, 2008
Publication number29309698, 309698, US D600220 S1, US D600220S1, US-S1-D600220, USD600220 S1, USD600220S1
InventorsIzumi Sato
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US D600220 S1
Images(8)
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Claims(1)
  1. The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
Description

FIG. 1 is a perspective view;

FIG. 2 is a front view;

FIG. 3 is a rear view;

FIG. 4 is a right side view the left side being a mirror image thereof;

FIG. 5 is a plan view;

FIG. 6 is a bottom view; and,

FIG. 7 is a sectional view thereof along line 77 of FIG. 2.

Classifications
U.S. ClassificationD13/182, D13/179