FIG. 1 is a front view;
FIG. 2 is a partial enlarged perspective view of a bottom along 2—2 of the frontal view shown in FIG. 1;
FIG. 3 is a rear view;
FIG. 4 is a left side view the right side being a mirror image thereof;
FIG. 5 is a plan view;
FIG. 6 is a bottom view;
FIG. 7 is an enlarged bottom view; and,
FIG. 8 is a partially enlarged sectional view, along 2—2 of the front view shown in FIG. 1 and line 8—8 of the bottom view shown in FIG. 6, of the wafer boat in use.
Salients are formed on the bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and prevent it from falling down in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.