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Publication numberUSD600221 S1
Publication typeGrant
Application numberUS 29/309,699
Publication dateSep 15, 2009
Filing dateSep 26, 2008
Priority dateMar 28, 2008
Publication number29309699, 309699, US D600221 S1, US D600221S1, US-S1-D600221, USD600221 S1, USD600221S1
InventorsIzumi Sato
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Wafer boat
US D600221 S1
Abstract  available in
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  1. The ornamental design for a wafer boat, as shown and described.

FIG. 1 is a front view;

FIG. 2 is a partial enlarged perspective view of a bottom along 22 of the frontal view shown in FIG. 1;

FIG. 3 is a rear view;

FIG. 4 is a left side view the right side being a mirror image thereof;

FIG. 5 is a plan view;

FIG. 6 is a bottom view;

FIG. 7 is an enlarged bottom view; and,

FIG. 8 is a partially enlarged sectional view, along 22 of the front view shown in FIG. 1 and line 88 of the bottom view shown in FIG. 6, of the wafer boat in use.

Salients are formed on the bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and prevent it from falling down in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

U.S. ClassificationD13/182