|Publication number||USD600221 S1|
|Application number||US 29/309,699|
|Publication date||Sep 15, 2009|
|Filing date||Sep 26, 2008|
|Priority date||Mar 28, 2008|
|Publication number||29309699, 309699, US D600221 S1, US D600221S1, US-S1-D600221, USD600221 S1, USD600221S1|
|Original Assignee||Tokyo Electron Limited|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
US D600221 S1
The ornamental design for a wafer boat, as shown and described.
FIG. 1 is a front view;
FIG. 2 is a partial enlarged perspective view of a bottom along 2—2 of the frontal view shown in FIG. 1;
FIG. 3 is a rear view;
FIG. 4 is a left side view the right side being a mirror image thereof;
FIG. 5 is a plan view;
FIG. 6 is a bottom view;
FIG. 7 is an enlarged bottom view; and,
FIG. 8 is a partially enlarged sectional view, along 2—2 of the front view shown in FIG. 1 and line 8—8 of the bottom view shown in FIG. 6, of the wafer boat in use.
Salients are formed on the bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and prevent it from falling down in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.