|Publication number||USD600222 S1|
|Application number||US 29/309,701|
|Publication date||Sep 15, 2009|
|Filing date||Sep 26, 2008|
|Priority date||Mar 28, 2008|
|Publication number||29309701, 309701, US D600222 S1, US D600222S1, US-S1-D600222, USD600222 S1, USD600222S1|
|Original Assignee||Tokyo Electron Limited|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (2), Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
US D600222 S1
The ornamental design for a wafer boat, as shown and described.
FIG. 1 is a front view;
FIG. 2 is a partial enlarged perspective view of a bottom along 2—2 of the frontal view shown in FIG. 1;
FIG. 3 is an enlarged bottom view;
FIG. 4 is a rear view;
FIG. 5 is a left side view the right side being a mirror image thereof;
FIG. 6 is a plan view;
FIG. 7 is a bottom view; and,
FIG. 8 is a partial, enlarged view, along 2—2 of a front view shown in FIG. 1 of the wafer boat in use.
Salients are formed on a bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and stabilize it in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.
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