Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD602447 S1
Publication typeGrant
Application numberUS 29/306,131
Publication dateOct 20, 2009
Priority dateApr 3, 2008
Also published asUSD616386
Publication number29306131, 306131, US D602447 S1, US D602447S1, US-S1-D602447, USD602447 S1, USD602447S1
InventorsChung-Han Sheng, Yi-Wen Chen
Original AssigneeEverlight Electronics Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Housing of a light emitting diode package
US D602447 S1
Abstract  available in
Images(5)
Previous page
Next page
Claims(1)
  1. The ornamental design for a housing of a light emitting diode package, as shown and described.
Description

FIG. 1 is a perspective view of a housing of a light emitting diode package showing the new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof wherein the broken line showing portion of the LED is for illustrative purpose only and forms no part of the claimed design;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a top view thereof, the bottom view being a mirror image of the top side view.

The claimed housing of a light emitting diode package includes a pair of leads. Both of the leads extend toward the rear side of the housing through two opposite sides of the housing and are not protruding out of the outer surfaces of the housing. Therefore, the housing is not only suitable for being used in a side view light emitting diode package but a top view light emitting diode package.

Classifications
U.S. ClassificationD13/180