|Publication number||USD602447 S1|
|Application number||US 29/306,131|
|Publication date||Oct 20, 2009|
|Priority date||Apr 3, 2008|
|Also published as||USD616386|
|Publication number||29306131, 306131, US D602447 S1, US D602447S1, US-S1-D602447, USD602447 S1, USD602447S1|
|Inventors||Chung-Han Sheng, Yi-Wen Chen|
|Original Assignee||Everlight Electronics Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Housing of a light emitting diode package
US D602447 S1
The ornamental design for a housing of a light emitting diode package, as shown and described.
FIG. 1 is a perspective view of a housing of a light emitting diode package showing the new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof wherein the broken line showing portion of the LED is for illustrative purpose only and forms no part of the claimed design;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a top view thereof, the bottom view being a mirror image of the top side view.
The claimed housing of a light emitting diode package includes a pair of leads. Both of the leads extend toward the rear side of the housing through two opposite sides of the housing and are not protruding out of the outer surfaces of the housing. Therefore, the housing is not only suitable for being used in a side view light emitting diode package but a top view light emitting diode package.