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Publication numberUSD606502 S1
Publication typeGrant
Application numberUS 29/326,900
Publication dateDec 22, 2009
Filing dateOct 27, 2008
Priority dateOct 27, 2008
Publication number29326900, 326900, US D606502 S1, US D606502S1, US-S1-D606502, USD606502 S1, USD606502S1
InventorsBishou Chen, Yinghua Wang, Peng Wang, Sheng Li, Xiaodong Gu
Original AssigneeShanghai Sansi Technology Co., Ltd, Shanghai Sansi Electronics Engineering Co., Ltd
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipating unit
US D606502 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a heat dissipating unit, as shown and described.
Description

FIG. 1 is a perspective view of a heat dissipating unit showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side, elevational view thereof;

FIG. 5 is a right-side, elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken line showing of portion of the heat dissipating unit is for illustrative purpose only and forms no part of the claimed design.

Classifications
U.S. ClassificationD13/179
Legal Events
DateCodeEventDescription
Dec 3, 2008ASAssignment
Owner name: DONGBU HITEK CO., LTD., KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JANG, IN-HEE;LEE, KUN-HYUK;REEL/FRAME:021919/0143
Effective date: 20081023