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Publication numberUSD606951 S1
Publication typeGrant
Application numberUS 29/327,836
Publication dateDec 29, 2009
Priority dateNov 14, 2008
Publication number29327836, 327836, US D606951 S1, US D606951S1, US-S1-D606951, USD606951 S1, USD606951S1
InventorsShin Soyano, Akira Nishiura
Original AssigneeFuji Electric Device Technology Co, Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor device
US D606951 S1
Abstract  available in
Images(6)
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Claims(1)
  1. The ornamental design for semiconductor device, as shown and described.
Description

FIG. 1 is a perspective view of the front, left and bottom of semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20150130043 *May 16, 2013May 14, 2015Kyocera CorporationSemiconductor element housing package, semiconductor device, and mounting structure
USD731491 *Feb 7, 2014Jun 9, 2015NimbeLink L.L.C.Embedded cellular modem
USD742842 *Sep 23, 2014Nov 10, 2015Lem Intellectual Property SaElectrical current transducer
USD748595 *Feb 3, 2015Feb 2, 2016Infineon Technologies AgPower semiconductor module
USD754084 *Nov 8, 2013Apr 19, 2016Mitsubishi Electric CorporationSemiconductor device
USD755741 *Feb 18, 2015May 10, 2016Semiconductor Components Industries, LlcPower device package
USD755742 *Feb 18, 2015May 10, 2016Semiconductor Components Industries, LlcPower device package
USD759604 *Jun 17, 2015Jun 21, 2016Mitsubishi Electric CorporationSemiconductor device
Classifications
U.S. ClassificationD13/182