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Publication numberUSD607424 S1
Publication typeGrant
Application numberUS 29/266,907
Publication dateJan 5, 2010
Filing dateOct 2, 2006
Priority dateMar 30, 2006
Also published asUSD602882
Publication number266907, 29266907, US D607424 S1, US D607424S1, US-S1-D607424, USD607424 S1, USD607424S1
InventorsHiroki Hosaka, Shuji Akiyama, Tadashi Obikane
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Wafer carrying-in/out apparatus
US D607424 S1
Abstract  available in
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Claims(1)
  1. The ornamental design for a wafer carrying-in/out apparatus or the like, as shown and described.
Description

FIG. 1 is a top plan view of a wafer carrying-in/out apparatus or the like, showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a top, front and right side perspective view thereof;

FIG. 8 is a top, front and right side perspective view thereof shown when the doors thereof have been opened;

FIG. 9 is a front elevational view thereof shown with the windows thereof installed;

FIG. 10 is a left side elevational view thereof; and,

FIG. 11 is a rear elevational view thereof.

The features shown in broken lines in the drawings form no part of the claimed design.

Classifications
U.S. ClassificationD13/182