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Publication numberUSD608876 S1
Publication typeGrant
Application numberUS 29/338,364
Publication dateJan 26, 2010
Filing dateJun 10, 2009
Priority dateMar 21, 2009
Publication number29338364, 338364, US D608876 S1, US D608876S1, US-S1-D608876, USD608876 S1, USD608876S1
InventorsHsin-Fei Huang, Zheng-Jay Huang, Chien-Ting Lu, Ying-Ching Chen, Yu-Pin Liu
Original AssigneeFoxsemicon Integrated Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation apparatus
US D608876 S1
Abstract  available in
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  1. We claim, the ornamental design for a heat dissipation apparatus, as shown.

FIG. 1 is a perspective view of a heat dissipation apparatus showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

U.S. ClassificationD23/323, D13/179