|Publication number||USD608876 S1|
|Application number||US 29/338,364|
|Publication date||Jan 26, 2010|
|Filing date||Jun 10, 2009|
|Priority date||Mar 21, 2009|
|Publication number||29338364, 338364, US D608876 S1, US D608876S1, US-S1-D608876, USD608876 S1, USD608876S1|
|Inventors||Hsin-Fei Huang, Zheng-Jay Huang, Chien-Ting Lu, Ying-Ching Chen, Yu-Pin Liu|
|Original Assignee||Foxsemicon Integrated Technology, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (2) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Heat dissipation apparatus
US D608876 S1
We claim, the ornamental design for a heat dissipation apparatus, as shown.
FIG. 1 is a perspective view of a heat dissipation apparatus showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.