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Publication numberUSD609652 S1
Publication typeGrant
Application numberUS 29/331,222
Publication dateFeb 9, 2010
Filing dateJan 22, 2009
Priority dateJul 22, 2008
Publication number29331222, 331222, US D609652 S1, US D609652S1, US-S1-D609652, USD609652 S1, USD609652S1
InventorsMunetoshi Nagasaka, Ikuo Ogasawara, Eiichi SHINOHARA
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Wafer attracting plate
US D609652 S1
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  1. The ornamental design for wafer attracting plate, as shown and described.

FIG. 1 is a perspective view of the wafer attracting plate, showing our design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a plan view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a right side view thereof; and,

FIG. 8 is a section view taken along a line as shown in FIG. 2.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8308931Nov 7, 2008Nov 13, 2012Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
U.S. ClassificationD13/182