FIG. 1 is a top perspective view of a coater cup showing new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a vertical sectional view taken along line 7—7 of FIG. 5 thereof; and,
FIG. 8 is an enlarged view taken along line 8—8 of FIG. 7 thereof.
The article is mounted on an upper end opening portion of a cup base portion surrounding a lower portion side of a spin chuck of a coater which holds a semiconductor wafer.