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Publication numberUSD610557 S1
Publication typeGrant
Application numberUS 29/338,647
Publication dateFeb 23, 2010
Filing dateJun 16, 2009
Priority dateJun 16, 2009
Publication number29338647, 338647, US D610557 S1, US D610557S1, US-S1-D610557, USD610557 S1, USD610557S1
InventorsWei-Hau Chen, Shih-Hsi Yen
Original AssigneeComptake Technology Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink for read only memory device
US D610557 S1
Abstract  available in
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  1. The ornamental design for a heat sink for read only memory device, as shown and described.

FIG. 1 is a perspective view of a heat sink for read only memory device showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD761744Oct 27, 2014Jul 19, 2016Corsair Memory, Inc.Heat spreader with fins and top bar on a memory module
U.S. ClassificationD13/179