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Publication numberUSD611013 S1
Publication typeGrant
Application numberUS 29/309,700
Publication dateMar 2, 2010
Filing dateSep 26, 2008
Priority dateMar 28, 2008
Publication number29309700, 309700, US D611013 S1, US D611013S1, US-S1-D611013, USD611013 S1, USD611013S1
InventorsKiyohiko Takahashi
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Process tube for manufacturing semiconductor wafers
US D611013 S1
Abstract  available in
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  1. The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described.

FIG. 1 is a perspective view;

FIG. 2 is a front view;

FIG. 3 is a rear view;

FIG. 4 is a left side view and the right side being a mirror image thereof;

FIG. 5 is a plan view and the bottom plan being a mirror image thereof;

FIG. 6 is a sectional view thereof along 66 of the plan view shown in FIG. 5;

FIG. 7 is an enlarged sectional view along 77 of the rear view shown in FIG. 3; and,

FIG. 8 is a view of process tube for manufacturing semiconductor wafers in use wherein the broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

U.S. ClassificationD13/182