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Publication numberUSD612344 S1
Publication typeGrant
Application numberUS 29/339,852
Publication dateMar 23, 2010
Filing dateJul 8, 2009
Priority dateJun 5, 2009
Publication number29339852, 339852, US D612344 S1, US D612344S1, US-S1-D612344, USD612344 S1, USD612344S1
InventorsAn-Chi Wei, Shan-Ju Lin
Original AssigneeFoxsemicon Integrated Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D612344 S1
Images(8)
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Claims(1)
  1. The ornamental design for a heat dissipation device, as shown.
Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Classifications
U.S. ClassificationD13/179