|Publication number||USD612344 S1|
|Application number||US 29/339,852|
|Publication date||Mar 23, 2010|
|Filing date||Jul 8, 2009|
|Priority date||Jun 5, 2009|
|Publication number||29339852, 339852, US D612344 S1, US D612344S1, US-S1-D612344, USD612344 S1, USD612344S1|
|Inventors||An-Chi Wei, Shan-Ju Lin|
|Original Assignee||Foxsemicon Integrated Technology, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Heat dissipation device
US D612344 S1
The ornamental design for a heat dissipation device, as shown.
FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.