USD612817S1 - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- USD612817S1 USD612817S1 US29/304,551 US30455108F USD612817S US D612817 S1 USD612817 S1 US D612817S1 US 30455108 F US30455108 F US 30455108F US D612817 S USD612817 S US D612817S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
- accordance
- new design
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Description
The broken line showing of environment (the remaining structure of the light emitting diode) in the FIGS. 1–10 is for illustrative purposes only and forms no part of the claimed design.
Claims (1)
- The ornamental design for a light emitting diode, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/304,551 USD612817S1 (en) | 2006-09-11 | 2008-03-04 | Light emitting diode |
US29/355,627 USD662901S1 (en) | 2006-09-11 | 2010-02-11 | Light emitting diode |
Applications Claiming Priority (26)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-024199 | 2006-02-01 | ||
JP2006-024184 | 2006-09-11 | ||
JP2006024207 | 2006-09-11 | ||
JP2006-024204 | 2006-09-11 | ||
JP2006024150 | 2006-09-11 | ||
JP2006024199 | 2006-09-11 | ||
JP2006024203 | 2006-09-11 | ||
JP2006-024150 | 2006-09-11 | ||
JP2006-024198 | 2006-09-11 | ||
JP2006-024205 | 2006-09-11 | ||
JP2006024201 | 2006-09-11 | ||
JP2006024206 | 2006-09-11 | ||
JP2006024184 | 2006-09-11 | ||
JP2006-024201 | 2006-09-11 | ||
JP2006024205 | 2006-09-11 | ||
JP2006-024203 | 2006-09-11 | ||
JP2006024202 | 2006-09-11 | ||
JP2006024198 | 2006-09-11 | ||
JP2006-024206 | 2006-09-11 | ||
JP2006-024200 | 2006-09-11 | ||
JP2006-024207 | 2006-09-11 | ||
JP2006-024202 | 2006-09-11 | ||
JP2006024204 | 2006-09-11 | ||
JP2006024200 | 2006-09-11 | ||
US29/273,595 USD569353S1 (en) | 2006-09-11 | 2007-03-09 | Light emitting diode |
US29/304,551 USD612817S1 (en) | 2006-09-11 | 2008-03-04 | Light emitting diode |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/273,595 Division USD569353S1 (en) | 2006-09-11 | 2007-03-09 | Light emitting diode |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/355,627 Division USD662901S1 (en) | 2006-09-11 | 2010-02-11 | Light emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
USD612817S1 true USD612817S1 (en) | 2010-03-30 |
Family
ID=39388043
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/273,595 Expired - Lifetime USD569353S1 (en) | 2006-09-11 | 2007-03-09 | Light emitting diode |
US29/304,551 Expired - Lifetime USD612817S1 (en) | 2006-09-11 | 2008-03-04 | Light emitting diode |
US29/355,627 Active USD662901S1 (en) | 2006-09-11 | 2010-02-11 | Light emitting diode |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/273,595 Expired - Lifetime USD569353S1 (en) | 2006-09-11 | 2007-03-09 | Light emitting diode |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/355,627 Active USD662901S1 (en) | 2006-09-11 | 2010-02-11 | Light emitting diode |
Country Status (1)
Country | Link |
---|---|
US (3) | USD569353S1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100631903B1 (en) * | 2005-02-17 | 2006-10-11 | 삼성전기주식회사 | High power LED housing and its manufacturing method |
USD737499S1 (en) * | 2012-07-13 | 2015-08-25 | Asahi Rubber Inc. | Lens for light-emitting diode |
-
2007
- 2007-03-09 US US29/273,595 patent/USD569353S1/en not_active Expired - Lifetime
-
2008
- 2008-03-04 US US29/304,551 patent/USD612817S1/en not_active Expired - Lifetime
-
2010
- 2010-02-11 US US29/355,627 patent/USD662901S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD569353S1 (en) | 2008-05-20 |
USD662901S1 (en) | 2012-07-03 |
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