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Publication numberUSD614593 S1
Publication typeGrant
Application numberUS 29/331,023
Publication dateApr 27, 2010
Filing dateJan 16, 2009
Priority dateJul 21, 2008
Publication number29331023, 331023, US D614593 S1, US D614593S1, US-S1-D614593, USD614593 S1, USD614593S1
InventorsJeong Ho Lee, Sang Jin Jeong, Dong Rak Jung
Original AssigneeAsm Genitech Korea Ltd
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Substrate support for a semiconductor deposition apparatus
US D614593 S1
Abstract  available in
Images(6)
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Claims(1)
  1. The ornamental design for a substrate support for a semiconductor deposition apparatus, as shown and described.
Description

FIG. 1 is a perspective view of a substrate support that may be positioned in a reaction space of a chamber in a semiconductor deposition apparatus, showing our new design, wherein the four small circles on the top surface of the support represent through-holes;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a perspective view of the substrate support cut along a line passing through the center of the support with a partial enlarged view showing a transition from a center recess on the top surface of the support and an outer shoulder at the outer portion of the support; and,

FIG. 9 is a cross-sectional view thereof, along a line passing through the center of the support.

The ornamental design which is claimed is shown in solid lines in the drawings.

Non-Patent Citations
Reference
1Givens et al., Substrate Holder With Varying Density, U.S. Appl. No. 12/266,317, filed on Nov. 6, 2008.
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US20100032310 *Nov 7, 2008Feb 11, 2010Novellus Systems, Inc.Method and apparatus for electroplating
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USD791091 *Jun 24, 2016Jul 4, 2017Hitachi Kokusai Electric Inc.Pattern wafer
USD793971Mar 27, 2015Aug 8, 2017Veeco Instruments Inc.Wafer carrier with a 14-pocket configuration
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Classifications
U.S. ClassificationD13/182