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Publication numberUSD614593 S1
Publication typeGrant
Application numberUS 29/331,023
Publication dateApr 27, 2010
Filing dateJan 16, 2009
Priority dateJul 21, 2008
Publication number29331023, 331023, US D614593 S1, US D614593S1, US-S1-D614593, USD614593 S1, USD614593S1
InventorsJeong Ho Lee, Sang Jin Jeong, Dong Rak Jung
Original AssigneeAsm Genitech Korea Ltd
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Substrate support for a semiconductor deposition apparatus
US D614593 S1
Abstract  available in
Images(6)
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Claims(1)
  1. The ornamental design for a substrate support for a semiconductor deposition apparatus, as shown and described.
Description

FIG. 1 is a perspective view of a substrate support that may be positioned in a reaction space of a chamber in a semiconductor deposition apparatus, showing our new design, wherein the four small circles on the top surface of the support represent through-holes;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a perspective view of the substrate support cut along a line passing through the center of the support with a partial enlarged view showing a transition from a center recess on the top surface of the support and an outer shoulder at the outer portion of the support; and,

FIG. 9 is a cross-sectional view thereof, along a line passing through the center of the support.

The ornamental design which is claimed is shown in solid lines in the drawings.

Non-Patent Citations
Reference
1Givens et al., Substrate Holder With Varying Density, U.S. Appl. No. 12/266,317, filed on Nov. 6, 2008.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Classifications
U.S. ClassificationD13/182