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Publication numberUSD615504 S1
Publication typeGrant
Application numberUS 29/292,900
Publication dateMay 11, 2010
Filing dateOct 31, 2007
Priority dateOct 31, 2007
Publication number292900, 29292900, US D615504 S1, US D615504S1, US-S1-D615504, USD615504 S1, USD615504S1
InventorsBernd Keller, Nicholas Medendorp, JR., Thomas Cheng-Hsin Yuan
Original AssigneeCree, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Emitter package
US D615504 S1
Images(13)
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Claims(1)
  1. The ornamental design for an emitter package, as shown and described.
Description

FIG. 1 is a perspective view of the first embodiment of an emitter package showing our design;

FIG. 2 is a top plan view of the emitter package shown in FIG. 1;

FIG. 3 is a bottom plan view of the emitter package shown in FIG. 1;

FIG. 4 is front elevation view of the emitter package shown in FIG. 1, with the back elevation view being a mirror image thereof;

FIG. 5 is a right side elevation view of the emitter package shown in FIG. 1, with the left side elevation view being a mirror image thereof;

FIG. 6 is a bottom perspective view of the emitter package shown in FIG. 1;

FIG. 7 is a top perspective view of the second embodiment of an emitter package showing our design;

FIG. 8 is a top plan view of the emitter package shown in FIG. 7;

FIG. 9 is a bottom plan view of the emitter package shown in FIG. 7;

FIG. 10 is front elevation view of the emitter package shown in FIG. 7, with the back elevation view being a mirror thereof;

FIG. 11 is a right side elevation view of the emitter package shown in FIG. 7, with the left side elevation view being a mirror image thereof;

FIG. 12 is a bottom perspective view of the emitter package shown in FIG. 7;

FIG. 13 is a perspective view of the third embodiment of an emitter package showing our design;

FIG. 14 is a top plan view of the emitter package shown in FIG. 13;

FIG. 15 is a bottom plan view of the emitter package shown in FIG. 13;

FIG. 16 is front elevation view of the emitter package shown in FIG. 13, with the back elevation view being a mirror image thereof;

FIG. 17 is a right side elevation view of the emitter package shown in FIG. 13, with the left side elevation view being a mirror image thereof;

FIG. 18 is a bottom perspective view of the emitter package shown in FIG. 13;

FIG. 19 is a perspective view of the fourth embodiment of an emitter package showing our design;

FIG. 20 is a top plan view of the emitter package shown in FIG. 19;

FIG. 21 is a bottom plan view of the emitter package shown in FIG. 19;

FIG. 22 is front elevation view of the emitter package shown in FIG. 19, with the back elevation view being a mirror image thereof;

FIG. 23 is a right side elevation view of the emitter package shown in FIG. 19, with the left side elevation view being a mirror image thereof;

FIG. 24 is a bottom perspective view of the emitter package shown in FIG. 19;

FIG. 25 is a perspective view of the fifth embodiment of an emitter package showing our design;

FIG. 26 is a top plan view of the emitter package shown in FIG. 25;

FIG. 27 is a bottom plan view of the emitter package shown in FIG. 25;

FIG. 28 is front elevation view of the emitter package shown in FIG. 25, with the back elevation view being a mirror image thereof;

FIG. 29 is a right side elevation view of the emitter package shown in FIG. 25, with the left side elevation view being a mirror image thereof;

FIG. 30 is a bottom perspective view of the emitter package shown in FIG. 25;

FIG. 31 is a perspective view of the sixth embodiment of an emitter package showing our design;

FIG. 32 is a top plan view of the emitter package shown in FIG. 31;

FIG. 33 is a bottom plan view of the emitter package shown in FIG. 31;

FIG. 34 is front elevation view of the emitter package shown in FIG. 31, with the back elevation view being a mirror image thereof;

FIG. 35 is a right side elevation view of the emitter package shown in FIG. 31, with the left side elevation view being a mirror image thereof; and,

FIG. 36 is a bottom perspective view of the emitter package shown in FIG. 31.

The broken line showing in the embodiments of FIGS. 1–6, 13–18, 19–24 and 25–30 are for illustrative purposes only and forms no part of the claimed design. The external surface having stippling or irregular lines in the embodiments of FIGS. 25–30 and 31–36 indicate a rough visual appearance of the side surfaces of the emitter package. The top layer can have be visually transparent or translucent as shown in the embodiments of FIGS. 1–6, 13–18, 19–24 and 25–30, and in some embodiments can optically distort the layer below.

Non-Patent Citations
Reference
1JP 2001 060072A , Abstract, Matsushita Electric Ind. Co Ltd., March 6, 222001.
2Kim J.K et al. "Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup" Japanese Journal of Applied Physics, Japan Society of Applied Physics, Tokyo, JP, vol. 44, No. 20-23, Jan. 1, 2005 XP-001236966, pp. 649-651.
3Nicha Corp., White LED Part No. NSPW312BS, Specification for Nichia White Led, Model NSPW312BS. Jan. 14, 2004.
4Nichia Corp. White LED Part No. NSPW300BS, Specification for Nichia White LED , Model NSPW300BS., Jan. 14, 2004.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7923739Jun 5, 2009Apr 12, 2011Cree, Inc.Solid state lighting device
US8269244Aug 10, 2010Sep 18, 2012Cree, Inc.LED package with efficient, isolated thermal path
US8492777Apr 2, 2011Jul 23, 2013Everlight Electronics Co., Ltd.Light emitting diode package, lighting device and light emitting diode package substrate
US8497522Apr 8, 2011Jul 30, 2013Cree, Inc.Solid state lighting device
US8598602Jun 28, 2010Dec 3, 2013Cree, Inc.Light emitting device packages with improved heat transfer
US8610140May 2, 2012Dec 17, 2013Cree, Inc.Light emitting diode (LED) packages, systems, devices and related methods
US8648359Sep 8, 2011Feb 11, 2014Cree, Inc.Light emitting devices and methods
US8686445Dec 15, 2010Apr 1, 2014Cree, Inc.Solid state lighting devices and methods
US8696159Jan 31, 2011Apr 15, 2014Cree, Inc.Multi-chip LED devices
Classifications
U.S. ClassificationD13/180