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Publication numberUSD615505 S1
Publication typeGrant
Application numberUS 29/340,831
Publication dateMay 11, 2010
Filing dateJul 27, 2009
Priority dateJul 27, 2009
Publication number29340831, 340831, US D615505 S1, US D615505S1, US-S1-D615505, USD615505 S1, USD615505S1
InventorsMark Butterworth, Thuy Vu, Gregory W. Eng, Nicola B. Pfeffer
Original AssigneeKoninklijke Philips Electronics N.V.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
LED package
US D615505 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for a LED package, substantially as shown and described.
Description

FIG. 1 is a front perspective view of the LED package.

FIG. 2 is a top plan view of the LED package of FIG. 1.

FIG. 3 is a lower side view of the LED package of FIG. 1.

FIG. 4 is a right side view of the LED package of FIG. 1.

FIG. 5 is a bottom plan view of the LED package of FIG. 1, wherein the broken lines are shown for illustrative purposes only and forms no part of the claimed design.

FIG. 6 is an upper side view of the LED package of FIG. 1; and,

FIG. 7 is a left side view of the LED package of FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8698184Jan 21, 2011Apr 15, 2014Cree, Inc.Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
US9735198Mar 15, 2013Aug 15, 2017Cree, Inc.Substrate based light emitter devices, components, and related methods
US9780268Jan 31, 2013Oct 3, 2017Cree, Inc.Submount based surface mount device (SMD) light emitter components and methods
USD738832 *Jan 31, 2013Sep 15, 2015Cree, Inc.Light emitting diode (LED) package
USD762184 *May 6, 2015Jul 26, 2016Mitsubishi Electric CorporationLight emitting diode
USD768584 *May 6, 2015Oct 11, 2016Mitsubishi Electric CorporationLight source module
USD780704 *Jan 30, 2015Mar 7, 2017Mitsubishi Electric CorporationLight source module
Classifications
U.S. ClassificationD13/180