|Publication number||USD616382 S1|
|Application number||US 29/346,029|
|Publication date||May 25, 2010|
|Filing date||Oct 26, 2009|
|Priority date||Jul 21, 2009|
|Publication number||29346029, 346029, US D616382 S1, US D616382S1, US-S1-D616382, USD616382 S1, USD616382S1|
|Inventors||Shan-Ju Lin, Hong-Bin Yang|
|Original Assignee||Foxsemicon Integrated Technology, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Heat dissipation device
US D616382 S1
The ornamental design for a heat dissipation device, as shown.
FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.