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Publication numberUSD616395 S1
Publication typeGrant
Application numberUS 29/342,857
Publication dateMay 25, 2010
Filing dateSep 2, 2009
Priority dateMar 11, 2009
Publication number29342857, 342857, US D616395 S1, US D616395S1, US-S1-D616395, USD616395 S1, USD616395S1
InventorsIzumi Sato
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Support of wafer boat for manufacturing semiconductor wafers
US D616395 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a support of wafer boat for manufacturing semiconductor wafers, as shown and described.
Description

FIG. 1 is front perspective view of a support of wafer boat for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view taken through line 88 of FIG. 2.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD734730 *Jun 26, 2013Jul 21, 2015Hitachi Kokusai Electric Inc.Boat of substrate processing apparatus
USD737785 *Jan 27, 2014Sep 1, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD738329 *Jan 27, 2014Sep 8, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD739831 *Sep 20, 2013Sep 29, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD740769 *Sep 20, 2013Oct 13, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD744967Aug 11, 2014Dec 8, 2015Veeco Instruments Inc.Spindle key
USD747279 *Jan 27, 2014Jan 12, 2016Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD748591Jan 14, 2015Feb 2, 2016Veeco Instruments Inc.Keyed spindle
Classifications
U.S. ClassificationD13/182