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Publication numberUSD616396 S1
Publication typeGrant
Application numberUS 29/342,858
Publication dateMay 25, 2010
Filing dateSep 2, 2009
Priority dateMar 12, 2009
Publication number29342858, 342858, US D616396 S1, US D616396S1, US-S1-D616396, USD616396 S1, USD616396S1
InventorsIzumi Sato
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
US D616396 S1
Abstract  available in
Images(9)
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Claims(1)
  1. The ornamental design for a pedestal of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
Description

FIG. 1 is front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken through line 88 of FIG. 2;

FIG. 9 is a cross-sectional view taken through line 99 of FIG. 2; and,

FIG. 10 is a front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8042697 *Jun 30, 2008Oct 25, 2011Memc Electronic Materials, Inc.Low thermal mass semiconductor wafer support
US8220646Jul 17, 2012Memc Electronic Materials, Inc.Low thermal mass semiconductor wafer plate
US8220647 *Sep 14, 2011Jul 17, 2012Memc Electronic Materials, Inc.Low thermal mass semiconductor wafer boat
US20090321372 *Dec 31, 2009Memc Electronic Materials, Inc.Low thermal mass semiconductor wafer support
US20100098519 *Oct 17, 2008Apr 22, 2010Memc Electronic Materials, Inc.Support for a semiconductor wafer in a high temperature environment
US20120077138 *Mar 29, 2012Memc Electronic Materials, Inc.Low Thermal Mass Semiconductor Wafer Boat
USD734730 *Jun 26, 2013Jul 21, 2015Hitachi Kokusai Electric Inc.Boat of substrate processing apparatus
USD737785 *Jan 27, 2014Sep 1, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD738329 *Jan 27, 2014Sep 8, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD739831 *Sep 20, 2013Sep 29, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD740769 *Sep 20, 2013Oct 13, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD747279 *Jan 27, 2014Jan 12, 2016Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
Classifications
U.S. ClassificationD13/182