|Publication number||USD618630 S1|
|Application number||US 29/337,861|
|Publication date||Jun 29, 2010|
|Filing date||May 30, 2009|
|Priority date||Mar 24, 2009|
|Publication number||29337861, 337861, US D618630 S1, US D618630S1, US-S1-D618630, USD618630 S1, USD618630S1|
|Inventors||Tien-Ho Wei, Yung-I Chen, Wen-Jang Jiang|
|Original Assignee||Foxsemicon Integrated Technology, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Heat dissipation apparatus
US D618630 S1
The ornamental design for a heat dissipation apparatus, as shown.
FIG. 1 is a perspective view of a heat dissipation apparatus showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.