|Publication number||USD618631 S1|
|Application number||US 29/339,854|
|Publication date||Jun 29, 2010|
|Filing date||Jul 8, 2009|
|Priority date||Jun 5, 2009|
|Publication number||29339854, 339854, US D618631 S1, US D618631S1, US-S1-D618631, USD618631 S1, USD618631S1|
|Inventors||An-Chi Wei, Shan-Ju Lin|
|Original Assignee||Foxsemicon Integrated Technology, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Heat dissipation device
US D618631 S1
The ornamental design for a heat dissipation device, as shown.
FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.