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Publication numberUSD618634 S1
Publication typeGrant
Application numberUS 29/346,255
Publication dateJun 29, 2010
Priority dateJul 21, 2009
Publication number29346255, 346255, US D618634 S1, US D618634S1, US-S1-D618634, USD618634 S1, USD618634S1
InventorsShan-Ju Lin, Hong-Bin Yang, Ming-Young Shiao
Original AssigneeFoxsemicon Integrated Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D618634 S1
Abstract  available in
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  1. The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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US9435525Mar 6, 2014Sep 6, 2016Soraa, Inc.Multi-part heat exchanger for LED lamps
US20100132931 *Jun 24, 2009Jun 3, 2010Shien-Kuei LiawThermal module for light source
US20110198979 *Aug 18, 2011Soraa, Inc.Illumination Source with Reduced Inner Core Size
US20110204763 *Aug 25, 2011Soraa, Inc.Illumination Source with Direct Die Placement
US20110204779 *Aug 25, 2011Soraa, Inc.Illumination Source and Manufacturing Methods
U.S. ClassificationD13/179