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Publication numberUSD618634 S1
Publication typeGrant
Application numberUS 29/346,255
Publication dateJun 29, 2010
Filing dateOct 29, 2009
Priority dateJul 21, 2009
Publication number29346255, 346255, US D618634 S1, US D618634S1, US-S1-D618634, USD618634 S1, USD618634S1
InventorsShan-Ju Lin, Hong-Bin Yang, Ming-Young Shiao
Original AssigneeFoxsemicon Integrated Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D618634 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a heat dissipation device, as shown.
Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8525396Feb 11, 2011Sep 3, 2013Soraa, Inc.Illumination source with direct die placement
US8618742Feb 11, 2011Dec 31, 2013Soraa, Inc.Illumination source and manufacturing methods
US8643257Feb 11, 2011Feb 4, 2014Soraa, Inc.Illumination source with reduced inner core size
US8791499May 24, 2010Jul 29, 2014Soraa, Inc.GaN containing optical devices and method with ESD stability
US8803452Oct 7, 2011Aug 12, 2014Soraa, Inc.High intensity light source
US20100132931 *Jun 24, 2009Jun 3, 2010Shien-Kuei LiawThermal module for light source
Classifications
U.S. ClassificationD13/179