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Publication numberUSD619548 S1
Publication typeGrant
Application numberUS 29/346,019
Publication dateJul 13, 2010
Filing dateOct 26, 2009
Priority dateJul 21, 2009
Publication number29346019, 346019, US D619548 S1, US D619548S1, US-S1-D619548, USD619548 S1, USD619548S1
InventorsYu-Pin Liu
Original AssigneeFoxsemicon Intergrated Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D619548 S1
Abstract  available in
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  1. The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing my new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8453715 *Oct 30, 2008Jun 4, 2013General Electric CompanySynthetic jet embedded heat sink
US9134078Mar 28, 2013Sep 15, 2015General Electric CompanySynthetic jet embedded heat sink
US9651318Mar 28, 2013May 16, 2017General Electric CompanySynthetic jet embedded heat sink
US20100110630 *Oct 30, 2008May 6, 2010Mehmet ArikSynthetic jet embedded heat sink
U.S. ClassificationD13/179