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Publication numberUSD619550 S1
Publication typeGrant
Application numberUS 29/346,028
Publication dateJul 13, 2010
Filing dateOct 26, 2009
Priority dateJul 21, 2009
Publication number29346028, 346028, US D619550 S1, US D619550S1, US-S1-D619550, USD619550 S1, USD619550S1
InventorsJyh-Der Hwang, Chao-Yi Yeh, Shan-Ju Lin
Original AssigneeFoxsemicon Integrated Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation device
US D619550 S1
Abstract  available in
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  1. The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

U.S. ClassificationD13/179