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Publication numberUSD619630 S1
Publication typeGrant
Application numberUS 29/290,247
Publication dateJul 13, 2010
Priority dateMay 8, 2007
Publication number290247, 29290247, US D619630 S1, US D619630S1, US-S1-D619630, USD619630 S1, USD619630S1
InventorsHirofumi Kaneko
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Process tube for manufacturing semiconductor wafers
US D619630 S1
Abstract  available in
Images(11)
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Claims(1)
  1. The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described.
Description

FIG. 1 is a perspective view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a sectional view through line 88 of FIG. 6;

FIG. 9 is an enlarged detailed top plan view of the portion of the process tube in the rectangle shown in FIG. 8; and,

FIG. 10 is an enlarged detailed sectional view taken along line 88 in FIG. 6 of the portion of the process tube in the rectangle shown in FIG. 8.

Environmental structure, which forms no part of the claimed design, is illustrated in broken lines.

The design is a type of process tube for decompression (vacuum) equipment.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD742339 *Sep 10, 2014Nov 3, 2015Hitachi Kokusai Electric Inc.Reaction tube
USD748594 *Sep 10, 2014Feb 2, 2016Hitachi Kokusai Electric Inc.Reaction tube
Classifications
U.S. ClassificationD15/138