|Publication number||USD622230 S1|
|Application number||US 29/352,788|
|Publication date||Aug 24, 2010|
|Filing date||Dec 28, 2009|
|Priority date||Nov 2, 2009|
|Publication number||29352788, 352788, US D622230 S1, US D622230S1, US-S1-D622230, USD622230 S1, USD622230S1|
|Inventors||Rong-Yih Yan, Hong-Bin Yang|
|Original Assignee||Foxsemicon Integrated Technology, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Heat dissipation apparatus
US D622230 S1
The ornamental design for a heat dissipation apparatus, as shown and described.
FIG. 1 is a perspective view of a heat dissipation apparatus in one operational state.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.