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Publication numberUSD622677 S1
Publication typeGrant
Application numberUS 29/337,278
Publication dateAug 31, 2010
Filing dateMay 19, 2009
Priority dateFeb 3, 2009
Publication number29337278, 337278, US D622677 S1, US D622677S1, US-S1-D622677, USD622677 S1, USD622677S1
InventorsChung-Chuan Hsieh
Original AssigneeEverlight Electronics Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light emitting diode package device
US D622677 S1
Abstract  available in
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  1. The ornamental design for a light emitting diode package device, as shown and described.

FIG. 1 is a front view of a light emitting diode package device with the new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof, wherein a metal element is disposed on the bottom of the LED package;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a sectional view thereof taken along line 88 in FIG. 5.

U.S. ClassificationD13/180