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Publication numberUSD622679 S1
Publication typeGrant
Application numberUS 29/340,658
Publication dateAug 31, 2010
Filing dateJul 22, 2009
Priority dateFeb 4, 2009
Publication number29340658, 340658, US D622679 S1, US D622679S1, US-S1-D622679, USD622679 S1, USD622679S1
InventorsChung-Chuan Hsieh
Original AssigneeEverlight Electronics Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light emitting diode package device
US D622679 S1
Images(9)
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Claims(1)
  1. The ornamental design for an light emitting diode package device, as shown and described.
Description

FIG. 1 is a front view of a light emitting diode package device with the new design, having a Fresnel lens with circular patterns;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a perspective view of bottom side thereof.

The cross sectional views shown in FIG. 8 is included for the purpose of showing external surface contours which may not be clear from the remaining illustrations. Any features of internal construction shown are incidental and form no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8698184Jan 21, 2011Apr 15, 2014Cree, Inc.Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
Classifications
U.S. ClassificationD13/180