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Publication numberUSD622680 S1
Publication typeGrant
Application numberUS 29/347,322
Publication dateAug 31, 2010
Filing dateDec 4, 2009
Priority dateDec 4, 2009
Publication number29347322, 347322, US D622680 S1, US D622680S1, US-S1-D622680, USD622680 S1, USD622680S1
InventorsChen-Hsiu Lin, Yi-Fei Lee, Chang-Yen Lin
Original AssigneeSilitek Electronic (Guangzhou) Go., Ltd., Lite-On Technology Corp.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Package of a light emitting diode
US D622680 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for package of a light emitting diode, as shown and described.
Description

FIG. 1 is a perspective view of package of a light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8269244Aug 10, 2010Sep 18, 2012Cree, Inc.LED package with efficient, isolated thermal path
US8497522Apr 8, 2011Jul 30, 2013Cree, Inc.Solid state lighting device
US8598602Jun 28, 2010Dec 3, 2013Cree, Inc.Light emitting device packages with improved heat transfer
US8610140May 2, 2012Dec 17, 2013Cree, Inc.Light emitting diode (LED) packages, systems, devices and related methods
US8648359Sep 8, 2011Feb 11, 2014Cree, Inc.Light emitting devices and methods
US8686445Dec 15, 2010Apr 1, 2014Cree, Inc.Solid state lighting devices and methods
US8860043Feb 2, 2011Oct 14, 2014Cree, Inc.Light emitting device packages, systems and methods
US8866166Jul 29, 2013Oct 21, 2014Cree, Inc.Solid state lighting device
US8878217Sep 14, 2012Nov 4, 2014Cree, Inc.LED package with efficient, isolated thermal path
US9111778Jan 21, 2011Aug 18, 2015Cree, Inc.Light emitting diode (LED) devices, systems, and methods
US9123874Dec 2, 2013Sep 1, 2015Cree, Inc.Light emitting device packages with improved heat transfer
US20110031865 *Jun 28, 2010Feb 10, 2011Hussell Christopher PLight emitting device packages with improved heat transfer
US20110180827 *Apr 8, 2011Jul 28, 2011Hussell Christopher PSolid state lighting device
US20110186873 *Feb 2, 2011Aug 4, 2011Emerson David TLight emitting device packages, systems and methods
USD665365 *Sep 27, 2010Aug 14, 2012Lite-On Technology CorporationLight-emitting diode
USD667384 *Nov 17, 2011Sep 18, 2012Lextar Electronics Corp.Light emitting diode lead-frame
USD667801Jul 11, 2011Sep 25, 2012Cree, Inc.Package for light emitting diode (LED) lighting
USD668233 *Oct 24, 2011Oct 2, 2012Silitek Electronic (Guangzhou) Co., Ltd.LED package
USD668623 *Nov 21, 2011Oct 9, 2012Lextar Electronics Corp.Light emitting diode package
USD669044 *Nov 23, 2011Oct 16, 2012Lextar Electronics Corp.Light emitting diode lead-frame
USD679842Jan 3, 2011Apr 9, 2013Cree, Inc.High brightness LED package
USD704358Apr 8, 2013May 6, 2014Cree, Inc.High brightness LED package
USD708156Sep 24, 2012Jul 1, 2014Cree, Inc.Package for light emitting diode (LED) lighting
USD793001 *Jun 24, 2016Jul 25, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
USD793002 *Jun 24, 2016Jul 25, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
USD793618 *Jun 24, 2016Aug 1, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
USD795492 *Jun 24, 2016Aug 22, 2017Semicon Light Co., Ltd.Mold for packaging semiconductor light emitting device
Classifications
U.S. ClassificationD13/180