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Publication numberUSD623150 S1
Publication typeGrant
Application numberUS 29/339,195
Publication dateSep 7, 2010
Filing dateJun 25, 2009
Priority dateFeb 4, 2009
Publication number29339195, 339195, US D623150 S1, US D623150S1, US-S1-D623150, USD623150 S1, USD623150S1
InventorsChung-Chuan Hsieh
Original AssigneeEverlight Electronics Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light emitting diode package device
US D623150 S1
Abstract  available in
Images(9)
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Claims(1)
  1. The ornamental design for a light emitting diode package device, as shown and described.
Description

FIG. 1 is a front view of a light emitting diode package device with the new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a perspective view of bottom side thereof.

Classifications
U.S. ClassificationD13/180