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Publication numberUSD627316 S1
Publication typeGrant
Application numberUS 29/330,441
Publication dateNov 16, 2010
Filing dateJan 7, 2009
Priority dateJan 7, 2009
Publication number29330441, 330441, US D627316 S1, US D627316S1, US-S1-D627316, USD627316 S1, USD627316S1
InventorsMatthew R. Theisen, Mark J. Brudevold
Original AssigneeGraco Minnesota Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heater board enclosure
US D627316 S1
Abstract  available in
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  1. The ornamental design for the heater board enclosure, as shown and described.

FIG. 1 is a front perspective view of the heater board enclosure;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a right side elevation view thereof and a mirror image of the left side;

FIG. 5 is a rear elevation view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a bottom perspective view thereof.

The broken lines showing portions of the heater board enclosure are shown for illustrative purpose only and forms no part of the claimed design.

Non-Patent Citations
1EFD ProcessMate 6500 Temperature Control Unit brochure.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8537540 *Nov 2, 2010Sep 17, 2013Technology Advancement Group, Inc.Field serviceable CPU module
US20120106070 *Nov 2, 2010May 3, 2012Trevor LandonField serviceable cpu module
US20120120594 *Nov 12, 2010May 17, 2012Tien-Sheng HuangHeat dissipating casing structure for main board
U.S. ClassificationD13/182