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Publication numberUSD633631 S1
Publication typeGrant
Application numberUS 29/293,900
Publication dateMar 1, 2011
Filing dateDec 14, 2007
Priority dateDec 14, 2007
Also published asUSD662902
Publication number29293900, 293900, US D633631 S1, US D633631S1, US-S1-D633631, USD633631 S1, USD633631S1
InventorsYuh-Ren Shieh, Chi-Wing Leung
Original AssigneeCree Hong Kong Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light source of light emitting diode
US D633631 S1
Abstract  available in
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  1. The ornamental design for an light source of light emitting diode, as shown and described.

FIG. 1 is a perspective view of one embodiment of an light source of light emitting diode showing our design;

FIG. 2 is a top plan view of the light source of light emitting diode shown in FIG. 1;

FIG. 3 is a bottom plan view of the light source of light emitting diode shown in FIG. 1;

FIG. 4 is a front elevation view of the light source of light emitting diode shown in FIG. 1, with the back elevation view being substantially similar; and,

FIG. 5 is a side elevation view of the light source of light emitting diode shown in FIG. 1, with the opposite side elevation view being substantially similar.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US3760237Jun 21, 1972Sep 18, 1973Gen ElectricSolid state lamp assembly having conical light director
US4307297Sep 12, 1979Dec 22, 1981U.S. Philips CorporationOpto-electronic device
US4511425Jun 13, 1983Apr 16, 1985Dennison Manufacturing CompanyHeated pad decorator
US5040868May 31, 1990Aug 20, 1991Siemens AktiengesellschaftSurface-mountable opto-component
US5130761Jul 15, 1991Jul 14, 1992Kabushiki Kaisha ToshibaLed array with reflector and printed circuit board
US5167556Jun 5, 1991Dec 1, 1992Siemens AktiengesellschaftMethod for manufacturing a light emitting diode display means
US5351106Jul 1, 1991Sep 27, 1994Amergraph CorporationExposure system
US5703401May 10, 1996Dec 30, 1997U.S. Philips CorporationMiniature semiconductor device for surface mounting
US5706177Dec 8, 1995Jan 6, 1998Temic Telefunken Microelectronic GmbhMulti-terminal surface-mounted electronic device
US5790298Dec 26, 1996Aug 4, 1998Gentex CorporationMethod of forming optically transparent seal and seal formed by said method
US5813753May 27, 1997Sep 29, 1998Philips Electronics North America CorporationUV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5907151May 27, 1997May 25, 1999Siemens AktiengesellschaftSurface mountable optoelectronic transducer and method for its production
US5959316Sep 1, 1998Sep 28, 1999Hewlett-Packard CompanyMultiple encapsulation of phosphor-LED devices
US6061160May 30, 1997May 9, 2000Dowa Mining Co., Ltd.Component device for optical communication
US6066861May 20, 1998May 23, 2000Siemens AktiengesellschaftWavelength-converting casting composition and its use
US6183100Oct 17, 1997Feb 6, 2001Truck-Lite Co., Inc.Light emitting diode 360 warning lamp
US6224216Feb 18, 2000May 1, 2001Infocus CorporationSystem and method employing LED light sources for a projection display
US6259608Apr 5, 1999Jul 10, 2001Delphi Technologies, Inc.Conductor pattern for surface mount devices and method therefor
US6274924Nov 5, 1998Aug 14, 2001Lumileds Lighting, U.S. LlcSurface mountable LED package
US6296367Oct 15, 1999Oct 2, 2001Armament Systems And Procedures, Inc.Rechargeable flashlight with step-up voltage converter and recharger therefor
US6359236Aug 13, 1996Mar 19, 2002Tessera, Inc.Mounting component with leads having polymeric strips
US6376902Jan 31, 2000Apr 23, 2002Osram Opto Semiconductors Gmbh & Co. OhgOptoelectronic structural element
US6454437Jul 28, 2000Sep 24, 2002William KellyRing lighting
US6469321Feb 5, 2002Oct 22, 2002Osram Opto Semiconductors Gmbh & Co. OhgSurface-mountable light-emitting diode structural element
US6480389Mar 19, 2002Nov 12, 2002Opto Tech CorporationHeat dissipation structure for solid-state light emitting device package
US6517218Dec 1, 2000Feb 11, 2003Relume CorporationLED integrated heat sink
US6573580Sep 27, 2002Jun 3, 2003Osram Opto Semiconductors Gmbh & Co. OhgSurface-mountable light-emitting diode structural element
US6610563Dec 15, 1998Aug 26, 2003Osram Opto Semiconductors Gmbh & Co. OhgSurface mounting optoelectronic component and method for producing same
US6614058Jul 9, 2002Sep 2, 2003Highlink Technology CorporationLight emitting semiconductor device with a surface-mounted and flip-chip package structure
US6624491Dec 29, 2000Sep 23, 2003Osram Opto Semiconductors Gmbh & Co.Diode housing
US6680490Jun 13, 2002Jan 20, 2004Toyoda Gosei Co., Ltd.Light-emitting device
US6686609Oct 1, 2002Feb 3, 2004Ultrastar LimitedPackage structure of surface mounting led and method of manufacturing the same
US6707069Jun 18, 2002Mar 16, 2004Samsung Electro-Mechanics Co., LtdLight emission diode package
US6710373Jul 22, 2002Mar 23, 2004Shih-Yi WangMeans for mounting photoelectric sensing elements, light emitting diodes, or the like
US6759733Apr 4, 2003Jul 6, 2004Osram Opto Semiconductors GmbhOptoelectric surface-mountable structural element
US6770498Oct 4, 2002Aug 3, 2004Lingsen Precision Industries, Ltd.LED package and the process making the same
US6774401Jul 14, 2003Aug 10, 2004Stanley Electric Co., Ltd.Light emitting diode
US6858879Jul 9, 2003Feb 22, 2005Osram Opto Semiconductors GmbhDiode housing
US6872585May 11, 2004Mar 29, 2005Toyoda Gosei Co., Ltd.LED device and manufacturing method thereof
US6876149Jan 23, 2003Apr 5, 2005Citizen Electronics Co., Ltd.Double-face LED device for an electronic instrument
US6900511Jun 27, 2003May 31, 2005Osram Opto Semiconductors GmbhOptoelectronic component and method for producing it
US6911678Sep 10, 2003Jun 28, 2005Stanley Electric Co., Ltd.Glass-sealed light-emitting diode
US6914268Feb 16, 2004Jul 5, 2005South Epitaxy CorporationLED device, flip-chip LED package and light reflecting structure
US6919586Mar 1, 2004Jul 19, 2005Rohm Co., Ltd.Side-emission type semiconductor light-emitting device and manufacturing method thereof
US6940704Jan 24, 2001Sep 6, 2005Gelcore, LlcSemiconductor light emitting device
US6946714May 16, 2003Sep 20, 2005Osram GmbhSurface mounting optoelectronic component and method for producing same
US6975011Apr 6, 2004Dec 13, 2005Osram GmbhOptoelectronic semiconductor component having multiple external connections
US6995510Jun 25, 2002Feb 7, 2006Hitachi Cable, Ltd.Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
US7021797Jun 12, 2003Apr 4, 2006Light Prescriptions Innovators, LlcOptical device for repositioning and redistributing an LED's light
US7064907May 27, 2004Jun 20, 2006Seiko Epson CorporationOptical part and its manufacturing method
US7066626Apr 8, 2004Jun 27, 2006Citizen Electronics Co., Ltd.LED lamp
US7102213Sep 5, 2003Sep 5, 2006Osram Opto Semiconductors GmbhLeadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method
US7119422Nov 15, 2004Oct 10, 2006Unity Opto Technology Co., Ltd.Solid-state semiconductor light emitting device
US7161189Jun 1, 2005Jan 9, 2007Lite-On Technology CorporationLED package including a frame
US7224000Apr 26, 2004May 29, 2007Lumination, LlcLight emitting diode component
US7285802Dec 21, 2004Oct 23, 20073M Innovative Properties CompanyIllumination assembly and method of making same
US20020061174Jan 22, 2001May 23, 2002Hans HurtElectro-optical data transfer module
US20020123163Apr 23, 2001Sep 5, 2002Takehiro FujiiEdge-emitting light-emitting semiconductor device and method of manufacture thereof
US20020163001May 4, 2001Nov 7, 2002Shaddock David MulfordSurface mount light emitting device package and fabrication method
US20020171911May 16, 2002Nov 21, 2002Mamoru MaegawaMethod for adjusting the hue of the light emitted by a light-emitting diode
US20020195935Jul 1, 2002Dec 26, 2002Harald JagerSurface-mountable light-emitting diode light source and method of producing a light-emitting diode light source
US20030116769Jun 18, 2002Jun 26, 2003Samsung Electro-Mechanics Co., Ltd.Light emission diode package
US20030183852Mar 18, 2003Oct 2, 2003Sharp Kabushiki KaishaLight emitting device and manufacturing method thereof
US20040041222May 27, 2003Mar 4, 2004Loh Ban P.Power surface mount light emitting die package
US20040047151Aug 22, 2001Mar 11, 2004Georg BognerOptoelectronic component and method for the production thereof, module and device comprising a module of this type
US20040079957Oct 22, 2003Apr 29, 2004Andrews Peter ScottPower surface mount light emitting die package
US20040080939Oct 22, 2003Apr 29, 2004Jules BraddellIlluminator
US20040126913Nov 25, 2003Jul 1, 2004Loh Ban P.Composite leadframe LED package and method of making the same
US20040227149Apr 29, 2004Nov 18, 2004Cree, Inc.High powered light emitter packages with compact optics
US20040232435Mar 1, 2004Nov 25, 2004Osram Opto Semiconductors GmbhOptoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body
US20040238930Jul 1, 2004Dec 2, 2004Osram Opto Semiconductors GmbhSurface-mountable light-emitting diode structural element
US20050023548Jul 31, 2003Feb 3, 2005Bhat Jerome C.Mount for semiconductor light emitting device
US20050072981Feb 19, 2003Apr 7, 2005Ryoma SuenagaLight-emitting device and process for producing thereof
US20050077535Oct 8, 2003Apr 14, 2005Joinscan Electronics Co., LtdLED and its manufacturing process
US20050093005Dec 2, 2004May 5, 2005Osram Opto Semiconductors GmbhOptoelectronic component and method for producing it
US20050117320Sep 27, 2004Jun 2, 2005Hon Hai Precision Industry Co., Ltd.Light-emitting diode and backlight system using the same
US20050127377Dec 2, 2002Jun 16, 2005Karlheinz ArndtOptoelectronic component
US20050135105Dec 19, 2003Jun 23, 2005Lumileds Lighting U.S., LlcLED package assembly
US20050152127Dec 16, 2004Jul 14, 2005Takayuki KamiyaLED lamp apparatus
US20050179376Feb 13, 2004Aug 18, 2005Fung Elizabeth C.L.Light emitting diode display device
US20050220046Jun 10, 2003Oct 6, 2005Thomas FalckToken-controlled formation of wireless work groups
US20060022212Aug 11, 2005Feb 2, 2006Osram Gmbh, A Germany CorporationSurface mounting optoelectronic component and method for producing same
US20060049477Nov 27, 2003Mar 9, 2006Karlheinz ArndtOptoelectronic component
US20060102917Jun 10, 2003May 18, 2006Toshihiko OyamaSemiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
US20060108594Nov 9, 2005May 25, 2006Kazuyuki IwasakiLED device and method for manufacturing the same
US20060133044Jul 8, 2005Jun 22, 2006Seoul Semiconductor Co., Ltd.Leadframe and packaged light emitting diode
US20060157828Sep 5, 2003Jul 20, 2006Osram Opto Semiconductor GmbhLeadframe - based housing, leadframe strip, surface - mounted optoelectronic -component, and production method
US20070046176Oct 27, 2006Mar 1, 2007Spudnik,Inc.Phosphor Compositions For Scanning Beam Displays
US20070109779Nov 9, 2006May 17, 2007Yoshifumi SekiguchiIlluminating device and liquid-crystal display device using the same
US20070170449Jan 22, 2007Jul 26, 2007Munisamy AnandanColor sensor integrated light emitting diode for LED backlight
US20070269586May 17, 2006Nov 22, 20073M Innovative Properties CompanyMethod of making light emitting device with silicon-containing composition
US20080013319Dec 7, 2006Jan 17, 2008Everlight Electronics Co., Ltd.Light emitting diode package
US20080074032Apr 8, 2005Mar 27, 2008Tadashi YanoMethod for Fabricating Led Illumination Light Source and Led Illumination Light Source
US20080121921Jul 13, 2006May 29, 2008Cree, Inc.Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
US20080186702Apr 7, 2008Aug 7, 2008Lumileds Lighting U.S., LlcArray of Light Emitting Devices to Produce a White Light Source
US20080191232Jul 26, 2006Aug 14, 2008Seoul Semiconductor Co., Ltd.Light Emitting Device With A Lens Of Silicone
US20080303052Aug 21, 2008Dec 11, 2008Seoul Semiconductor Co., Ltd.Light emitting diode package having multiple molding resins
US20090050908Jun 5, 2008Feb 26, 2009Cree, Inc.Solid state lighting component
US20090072251Dec 14, 2007Mar 19, 2009Cotco Luminant Device LimitedLED surface-mount device and LED display incorporating such device
US20090129085Nov 16, 2007May 21, 2009Avago Technologies Ecbu Ip (Singapore) Pte. Ltd.Optical device
US20090189178Jun 28, 2007Jul 30, 2009Do Hyung KimLeadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method
US20090283781May 16, 2008Nov 19, 2009Cree Hong Kong LimitedMini V SMD
USD572210Apr 30, 2007Jul 1, 2008Lg Innotek Co., Ltd.Light-emitting diode (LED)
USD572670Sep 22, 2006Jul 8, 2008Nichia CorporationLight emitting diode
USD576574Jan 15, 2008Sep 9, 2008Rohm Co., Ltd.Light emitting diode module
USD591697 *Aug 9, 2006May 5, 2009Cree, Inc.Lamp package
USD593224 *Nov 20, 2008May 26, 2009Electronic Controls CompanyLED lighting assembly
USD598579 *Nov 20, 2008Aug 18, 2009Electronic Controls CompanyLED lighting assembly
CN1581527AAug 12, 2004Feb 16, 2005西铁城电子股份有限公司Luminous diode
CN1591924AJul 28, 2004Mar 9, 2005西铁城电子股份有限公司Surface-mounted LED and light emitting device with same
CN1679168ASep 2, 2003Oct 5, 2005克立公司Power surface mount light emitting die package
CN1744335AAug 26, 2005Mar 8, 2006斯坦雷电气株式会社Surface mount LED
CN1801498AJan 7, 2005Jul 12, 2006北京大学Method for preparing LED chip with separate crystal grain vertical structure
CN101061590ANov 14, 2005Oct 24, 2007皇家飞利浦电子股份有限公司Illuminator and method for producing such illuminator
EP1005085A2Oct 16, 1999May 31, 2000Matsushita Electronics CorporationResin-encapsulated electronic device
EP1187226A1Sep 1, 2000Mar 13, 2002Citizen Electronics Co., Ltd.Surface-mount type light emitting diode and method of manufacturing same
EP1187227A2May 31, 1989Mar 13, 2002Osram Opto Semiconductors GmbH & Co. oHGSurface-mountable optical element and method of fabrication
EP1187228A1Feb 9, 2001Mar 13, 2002Nippon Leiz CorporationLight source
EP1521313A2Oct 1, 2004Apr 6, 2005LumiLeds Lighting U.S., LLCIntegrated reflector cup for a light emitting device mount
GB2420221A Title not available
JP8139257A Title not available
JP11167805A Title not available
JP2000223752A Title not available
WO2005043627A1Oct 20, 2004May 12, 2005Cree, Inc.Power surface mount light emitting die package
WO2006054228A3Nov 14, 2005Aug 3, 2006Samber Marc A DeIlluminator and method for producing such illuminator
Non-Patent Citations
1Declaration of Charles Swoboda, dated: Aug. 19, 2009.
2Declaration of Gerald Negley, dated: Aug. 20, 2009.
3First Office Action for Chinese Patent Application No. 200780019643.9 dated Mar. 29, 2010.
4International Search Report for PCT/CN2009/074800 mailed Feb. 25, 2010.
5International Search Report, International Application No. PCT/CN2008/070298, Mailed on Jun. 26, 2008.
6JP 2001 060072A , Abstract, Matsushita Electric Ind. Co Ltd., Mar. 6, 222001.
7Kim J.K et al. "Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup" Japanese Journal of Applied Physics, Japan Society of Applied Physics, Tokyo, JP, vol. 44, No. 20-23, Jan. 1, 2005 XP-001236966, pp. 649-651.
8Nicha Corp., White LED Part No. NSPW312BS, Specification for Nichia White LED, Model NSPW312BS. Jan. 14, 2004.
9Nichia Corp. White LED Part No. NSPW300BS, Specification for Nichia White LED , Model NSPW300BS., Jan. 14, 2004.
10Office Action from related China Application No. 200710142310.7, dated: Dec. 11, 2009.
11Office Action from U.S. Appl. No. 11/149,998, dated: May 18, 2010.
12Office Action from U.S. Appl. No. 11/149,998, dated: Nov. 20, 2009.
13Office Action from U.S. Appl. No. 11/465,120, dated: Mar. 9, 2010.
14Office Action from U.S. Appl. No. 12/069,827, dated: Apr. 20, 2010.
15Office Action from U.S. Appl. No. 12/152,766, dated: Mar. 12, 2010.
16Office Action from U.S. Appl. No. 12/154,691, dated: Dec. 17, 2009.
17Office Action from U.S. Appl. No. 12/321,059, dated: May 17, 2010.
18Official Notice of Decision for Refusal regarding related Japanese Design Application No. 2009-002857, dated Nov. 17, 2009.
19Preliminary Notice of Reasons for Refusal re related Japanese Application No. 2009-002857, dated: Apr. 24, 2009, pp. 1-2.
20Preliminary Notice of Reasons for Refusal re related Japanese Application No. 2009-002857, dated: Jul. 24, 2009.
21Response to Office Action from U.S. Appl. No. 11/149,998, dated: Feb. 22, 2010.
22Response to Office Action from U.S. Appl. No. 12/154,691, dated: May 17, 2010.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9461024Aug 1, 2013Oct 4, 2016Cree, Inc.Light emitter devices and methods for light emitting diode (LED) chips
USD735683May 3, 2013Aug 4, 2015Cree, Inc.LED package
USD738832 *Jan 31, 2013Sep 15, 2015Cree, Inc.Light emitting diode (LED) package
USD758976Aug 8, 2013Jun 14, 2016Cree, Inc.LED package
USD777122Feb 27, 2015Jan 24, 2017Cree, Inc.LED package
USD783547Jun 4, 2015Apr 11, 2017Cree, Inc.LED package
U.S. ClassificationD26/1