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Publication numberUSD634719 S1
Publication typeGrant
Application numberUS 29/356,450
Publication dateMar 22, 2011
Filing dateFeb 25, 2010
Priority dateAug 27, 2009
Publication number29356450, 356450, US D634719 S1, US D634719S1, US-S1-D634719, USD634719 S1, USD634719S1
InventorsHozumi Yasuda, Keisuke Namiki, Makoto Fukushima, Osamu Nabeya, Koji Saito, Satoru Yamaki, Tomoshi Inoue, Shingo Togashi, Tetsuji Togawa
Original AssigneeEbara Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Elastic membrane for semiconductor wafer polishing apparatus
US D634719 S1
Abstract  available in
Images(10)
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Claims(1)
  1. The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
Description

FIG. 1 is a bottom view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 8 is a cross-section view taken along the line 88 of FIG. 2 thereof;

FIG. 9 is a enlarged view of part 9 of FIG. 8 thereof;

FIG. 10 is a bottom view thereof;

FIG. 11 is a top view thereof;

FIG. 12 is a front view thereof;

FIG. 13 is a right side view thereof;

FIG. 14 is a rear view thereof;

FIG. 15 is a left side view thereof;

FIG. 16 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 17 is a cross-section view taken along the line 1717 of FIG. 11 thereof;

FIG. 18 is a enlarged view of part 18 of FIG. 17 thereof;

FIG. 19 is a bottom view thereof;

FIG. 20 is a top view thereof;

FIG. 21 is a front view thereof; (rear view is omit since it is identical with the front)

FIG. 22 is a right side view thereof; (left side view is omitted since it is identical with the right side view)

FIG. 23 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 24 is a cross-section view taken along the line 2424 of FIG. 20 thereof; and,

FIG. 25 is a enlarged view of part 25 of FIG. 24 thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

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Classifications
U.S. ClassificationD13/182