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Publication numberUSD635525 S1
Publication typeGrant
Application numberUS 29/335,819
Publication dateApr 5, 2011
Filing dateApr 22, 2009
Priority dateApr 22, 2009
Publication number29335819, 335819, US D635525 S1, US D635525S1, US-S1-D635525, USD635525 S1, USD635525S1
InventorsJohn A. Edmond, Michael J. Bergmann, Matthew Donofrio, Winston T. Parker
Original AssigneeCree, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
LED chip
US D635525 S1
Images(5)
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Claims(1)
  1. The ornamental design for a LED chip, as shown and described.
Description

FIG. 1 is a top perspective view of an LED chip showing our design;

FIG. 2 is a top view thereof;

FIG. 3 is a first side view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a different side view thereof;

FIG. 6 is an end view thereof;

FIG. 7 is an opposing end view thereof;

FIG. 8 is a top perspective view of the LED chip of FIG. 1 with the top surface removed;

FIG. 9 is a top view thereof;

FIG. 10 is a first side view thereof;

FIG. 11 is a bottom view thereof;

FIG. 12 is a different side view thereof;

FIG. 13 is an end view thereof; and,

FIG. 14 is an opposing end view thereof.

The broken lines define portions of the LED chip that form no part of the claimed design.

Non-Patent Citations
Reference
1Color photos—Lumileds LEDs No. 2 (for exam purposes, date is assumed to be before Dec. 21, 2006), 1 page.
2Image of "Lumileds LED" No. 4 (Oct. 2-4, 2002), 1 page.
3Image of OSRAM chip No. 3 (prior to Dec. 29, 2005), 1 page.
4Lumileds LED die; Philips/Lumileds Light from Silicon Valley "LED Die," pp. 1-2, http://www.lumileds.com/products/line.cm?lineId=16 (2006).
5SemiLEDS "Products", http://www.semileds.com/en—04product.asp (2006), 2 pages.
6Taiwanese Office Action and English Translation corresponding to Taiwanese Patent Application No. 097301339 dated Dec. 30, 2008, 9 pages.
Classifications
U.S. ClassificationD13/180