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Publication numberUSD640644 S1
Publication typeGrant
Application numberUS 29/375,076
Publication dateJun 28, 2011
Filing dateSep 17, 2010
Priority dateMar 19, 2010
Publication number29375076, 375076, US D640644 S1, US D640644S1, US-S1-D640644, USD640644 S1, USD640644S1
InventorsWen-Chieh Tsou
Original AssigneeEverlight Electronics Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light emitting diode package
US D640644 S1
Abstract  available in
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  1. I claim the ornamental design for a light emitting diode package, as shown and described.

FIG. 1 is a perspective view of a light emitting diode package in accordance with the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Non-Patent Citations
1Ni, "Light Emitting Diode Package", Pending U.S. Appl. No. 29/358,359, filed Mar. 26, 2010.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD737784 *Jul 30, 2014Sep 1, 2015Kingbright Electronics Co., Ltd.LED component
USD774475 *Feb 19, 2016Dec 20, 2016Kingbright Electronics Co. Ltd.LED component
USD778849 *Apr 4, 2016Feb 14, 2017Dowa Electronics Materials Co., Ltd.Light emitting diode chip
U.S. ClassificationD13/180