Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD641720 S1
Publication typeGrant
Application numberUS 29/358,472
Publication dateJul 19, 2011
Filing dateMar 26, 2010
Priority dateMar 26, 2010
Also published asUSD658607
Publication number29358472, 358472, US D641720 S1, US D641720S1, US-S1-D641720, USD641720 S1, USD641720S1
InventorsStephen Heng, Sanjay Dandia, Nikon Banouvong, Chia-Ken Leong
Original AssigneeAdvanced Micro Devices, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Circuit package lid
US D641720 S1
Abstract  available in
Previous page
Next page
  1. The ornamental design for a circuit package lid, as shown and described.

FIG. 1 is a front perspective view of a circuit package lid;

FIG. 2 is a front view of the circuit package lid;

FIG. 3 is a top view of the circuit package lid;

FIG. 4 is a bottom view of the circuit package lid;

FIG. 5 is a left side view of the circuit package lid;

FIG. 6 is a right side view of the circuit package lid; and,

FIG. 7 is a rear view of the circuit package lid.

Non-Patent Citations
1Advanced Micro Devices; AMD Socket F (1207) Design Specification; Publication No. 31700; Revision 1.03; Mar. 2006.
2L1 Package; 2008; pp. 1-3.
3Picture of Socket F design; from; Mar. 25, 2010.
4U.S. Appl. No. 29/358,435, filed Mar. 26, 2010.
5U.S. Appl. No. 29/358,436, filed Mar. 26, 2010.
6U.S. Appl. No. 29/358,467, filed Mar. 26, 2010.
7U.S. Appl. No. 29/358,468, filed Mar. 26, 2010.
8U.S. Appl. No. 29/358,473, filed Mar. 26, 2010.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD734732 *Jan 7, 2014Jul 21, 2015Sumitomo Electric Fine Polymer, Inc.Circuit board material
U.S. ClassificationD13/182