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Publication numberUSD641720 S1
Publication typeGrant
Application numberUS 29/358,472
Publication dateJul 19, 2011
Filing dateMar 26, 2010
Priority dateMar 26, 2010
Also published asUSD658607
Publication number29358472, 358472, US D641720 S1, US D641720S1, US-S1-D641720, USD641720 S1, USD641720S1
InventorsStephen Heng, Sanjay Dandia, Nikon Banouvong, Chia-Ken Leong
Original AssigneeAdvanced Micro Devices, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Circuit package lid
US D641720 S1
Images(4)
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Claims(1)
  1. The ornamental design for a circuit package lid, as shown and described.
Description

FIG. 1 is a front perspective view of a circuit package lid;

FIG. 2 is a front view of the circuit package lid;

FIG. 3 is a top view of the circuit package lid;

FIG. 4 is a bottom view of the circuit package lid;

FIG. 5 is a left side view of the circuit package lid;

FIG. 6 is a right side view of the circuit package lid; and,

FIG. 7 is a rear view of the circuit package lid.

Non-Patent Citations
Reference
1Advanced Micro Devices; AMD Socket F (1207) Design Specification; Publication No. 31700; Revision 1.03; Mar. 2006.
2L1 Package; 2008; pp. 1-3.
3Picture of Socket F design; from www.commons.wikimedia.org; Mar. 25, 2010.
4U.S. Appl. No. 29/358,435, filed Mar. 26, 2010.
5U.S. Appl. No. 29/358,436, filed Mar. 26, 2010.
6U.S. Appl. No. 29/358,467, filed Mar. 26, 2010.
7U.S. Appl. No. 29/358,468, filed Mar. 26, 2010.
8U.S. Appl. No. 29/358,473, filed Mar. 26, 2010.
Classifications
U.S. ClassificationD13/182