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Publication numberUSD648289 S1
Publication typeGrant
Application numberUS 29/377,521
Publication dateNov 8, 2011
Priority dateOct 21, 2010
Publication number29377521, 377521, US D648289 S1, US D648289S1, US-S1-D648289, USD648289 S1, USD648289S1
InventorsSteven T. Mayer, David Porter, Robert Rash
Original AssigneeNovellus Systems, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Electroplating flow shaping plate having offset spiral hole pattern
US D648289 S1
Abstract  available in
Images(17)
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Claims(1)
  1. We claim the ornamental design for an electroplating flow shaping plate having offset spiral hole pattern, as shown and described.
Description

FIG. 1 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing an embodiment of our new design;

FIG. 2 is a bottom view thereof;

FIG. 3 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;

FIG. 4 is a front perspective view thereof; and

FIG. 5 is a rear perspective view thereof.

FIG. 6 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a second embodiment of our new design;

FIG. 7 is a bottom view thereof;

FIG. 8 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;

FIG. 9 is a front perspective view thereof; and

FIG. 10 is a rear perspective view thereof.

FIG. 11 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a third embodiment of our new design;

FIG. 12 is a bottom view thereof; and

FIG. 13 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;

FIG. 14 is a front perspective view thereof; and

FIG. 15 is a rear perspective view thereof.

FIG. 16 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a fourth embodiment of our new design;

FIG. 17 is a bottom view thereof; and

FIG. 18 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;

FIG. 19 is a front perspective view thereof; and,

FIG. 20 is a rear perspective view thereof.

Non-Patent Citations
Reference
1U.S. Appl. No. 61/405,608, "Flow diverters and flow shaping plates for electroplating cells", Mayer et al., filed Oct. 21, 2010.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8308931Nov 7, 2008Nov 13, 2012Novellus Systems, Inc.Method and apparatus for electroplating
US8475636Jun 9, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8475644Oct 26, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US8968533May 10, 2012Mar 3, 2015Applied Materials, IncElectroplating processor with geometric electrolyte flow path
US9309604May 31, 2013Apr 12, 2016Novellus Systems, Inc.Method and apparatus for electroplating
US9394620Jun 18, 2014Jul 19, 2016Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Classifications
U.S. ClassificationD13/182