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Publication numberUSD648315 S1
Publication typeGrant
Application numberUS 29/362,637
Publication dateNov 8, 2011
Filing dateMay 27, 2010
Priority dateMay 27, 2010
Publication number29362637, 362637, US D648315 S1, US D648315S1, US-S1-D648315, USD648315 S1, USD648315S1
InventorsHsing-Yi Kao
Original AssigneeCheng Uei Precision Industry Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Earphone assembly
US D648315 S1
Abstract  available in
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  1. The ornamental design for an earphone assembly, as shown and described.

FIG. 1 is an earphone assembly, shown in an exploded perspective view for indeterminate length, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Separate portions of the claimed design shown respectively in FIGS. 1 and 4-7 to indicate that no particular length between the separate portions is claimed are bracketed to disclose and depict the claimed design as a whole.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD739377 *Jan 6, 2014Sep 22, 2015Lg Electronics Inc.Wireless headset
USD780726 *Dec 4, 2015Mar 7, 2017Howard WangWireless adapter
USD786825 *Sep 9, 2015May 16, 2017Comhear, Inc.Sound device
U.S. ClassificationD14/205