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Publication numberUSD654881 S1
Publication typeGrant
Application numberUS 29/359,100
Publication dateFeb 28, 2012
Filing dateApr 6, 2010
Priority dateOct 19, 2006
Also published asUSD573116, USD616387
Publication number29359100, 359100, US D654881 S1, US D654881S1, US-S1-D654881, USD654881 S1, USD654881S1
InventorsTa-Te Chou, Xiong-Jie Zhang, Xian Li, Hai Fu, Yong-Qi Tian
Original AssigneeVishay General Semiconductor Llc
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Bridge rectifier package with heat sink
US D654881 S1
Abstract  available in
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  1. The ornamental design for a new bridge rectifier package with heat sink, as shown and described.

FIG. 1 is a left, top perspective view of a new bridge rectifier package with heat sink showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a left view thereof;

FIG. 5 is a right view thereof;

FIG. 6 is a front view thereof; and,

FIG. 7 is a back view thereof.

Non-Patent Citations
1"Taiwan Fiber-Optic Transceiver Industry Gets a Lift from Japan," Asian Sources, Electronic Components, Jul. 2004, 2 pages.
U.S. ClassificationD13/182