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Publication numberUSD656909 S1
Publication typeGrant
Application numberUS 29/389,788
Publication dateApr 3, 2012
Filing dateApr 15, 2011
Priority dateOct 15, 2010
Also published asUSD680505
Publication number29389788, 389788, US D656909 S1, US D656909S1, US-S1-D656909, USD656909 S1, USD656909S1
InventorsKouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
Original AssigneeHitachi Chemical Company, Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Adhesive tape for semiconductor manufacturing
US D656909 S1
Abstract  available in
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Claims(1)
    CLAIM
  1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
Description

FIG. 1 is a top plan view of a first embodiment of our new design;

FIG. 2 is a bottom plan view of the first embodiment;

FIG. 3 is a left side view of the first embodiment;

FIG. 4 is a right side view of the first embodiment;

FIG. 5 is a rear side view of the first embodiment;

FIG. 6 is a front side view of the first embodiment;

FIG. 7 is a cross-sectional view of the first embodiment taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view of the first embodiment;

FIG. 9 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 1 for completeness of illustration.

FIG. 10 is a top plan view of a second embodiment of our new design;

FIG. 11 is a bottom plan view of the second embodiment;

FIG. 12 is a left side view of the second embodiment;

FIG. 13 is a right side view of the second embodiment;

FIG. 14 is a rear side view of the second embodiment;

FIG. 15 is a front side view of the second embodiment;

FIG. 16 is a cross-sectional view of the second embodiment taken at line 16-16 of FIG. 10;

FIG. 17 is an exploded view of the second embodiment;

FIG. 18 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 10 for completeness of illustration.

FIG. 19 is a top plan view of a third embodiment of our new design;

FIG. 20 is a bottom plan view of the third embodiment;

FIG. 21 is a left side view of the third embodiment;

FIG. 22 is a right side view of the third embodiment;

FIG. 23 is a rear side view of the third embodiment;

FIG. 24 is a front side view of the third embodiment;

FIG. 25 is a cross-sectional view of the third embodiment taken at line 25-25 of FIG. 19;

FIG. 26 is an exploded view of the third embodiment; and,

FIG. 27 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 19 for completeness of illustration.

Non-Patent Citations
Reference
1U.S. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al.
2U.S. Appl. No. 29/389,794, filed Apr. 15, 2011, Taniguchi et al.
3U.S. Appl. No. 29/389,797, filed Apr. 15, 2011, Taniguchi et al.
Classifications
U.S. ClassificationD13/182, D19/69